| Model | batch | |
| Number of layers | Floors 1-62 | Floors1-30 |
| Plate thickness | 0.1-14毫米 | 0.5-10mm |
| Minimum mechanical aperture | 0.125mm-0.15mm | 0.2mm |
| Minimum laser aperture | 3mil | 4mil |
| Minimum line width & spacing | 3/3mil，2.5/2.5mil（Need assessment） | 4/4mil，3/3mil（Need assessment） |
| Impedance control | ±5% | ±10% |
| Maximum copper thickness | Outer 12oz inner 6oz | Outer layer 6oz inner layer 6oz |
| Maximum plate thickness to aperture ratio | 14：1 | 12：1 |
| Minimum profile tolerance | ±0.1mm | ±0.1-0.15mm |
| Minimum warpage | 0.50% | 0.75% |
| Hole location tolerance | ±3mil | ±3-5mil |
| Maximum board size | 650mm X 1130mm | 610mm X 1100mm |
| board | FR-4/Hi-Tg/Rogers/Halogen Free/PTFE/Nelco/Mixed pressure material | |
| surface treatment |
OSP Lead free tin spray Tin spray with lead Chemical precipitation of gold Chemical deposition of tin Chemical precipitation of silver Gold Plated plug Flash Gold NiPdAu Palladium Non magnetic gold plating Local gold plating |
|
| Special processing | HDI、Blind hole、Step groove、Metal substrate、Embedded resistor、Embedded capacitor、Mixed pressure、Combination of software and hardware、Back drill、steps、Ordinary golden finger、Optical module | |
| Thermoelectric separation、Gold finger with long and short discontinuities、Cavity plate、impedance、Plugging with copper paste and silver paste resin、Carbon oil、Blue glue、laser cutting、Embedded copper、busbar、Crimping hole, etc | ||
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