| Sheet type note: | FR-4 (general) | The most widely used type of board in PCB manufacturing. It has good heat resistance, especially good welding resistance, small size change rate, high reliability of hole metallization, chemical resistance, and mature processing technology for producing multilayer board. The constant temperature of common FR4 is not more than 140 ℃. |
| FR-4 (normal) TG 150 degrees in FR-4 | It has the same properties as ordinary FR4 plate, but it is of medium heat resistance, so it is called FR-4 of medium TG, and its constant temperature service temperature can reach 150 ℃. | |
| FR-4 high tg170 degrees | It has the same properties as ordinary FR4 plate, but it has high heat resistance, so FR-4 with high Tg can be used at a constant temperature of 170 ℃. | |
| FR-4 halogen free | The most outstanding point of halogen-free substrate material is that the content of chlorine (CL) and bromine (BR) in the plate meets the requirements of "environmental protection" and human health. However, compared with the traditional FR4 substrate material, its chemical resistance, drilling processability, moisture resistance, there are still some deficiencies in different degrees, at the same time, the low cost still needs to be further improved. | |
| FR-4 halogen free + high TG | At the same time, it can meet the performance requirements of halogen-free plate and high Tg plate. | |
| Rogers | Low permittivity substrate material produced by Rogers company is mainly used for high frequency board (frequency higher than 1GHz). It can provide high-frequency plate with ceramic powder and high-frequency plate produced by polytetrafluoroethylene resin (PTFE). Rogers can provide different types of boards. If designers choose the materials of this company, they can consult the PCB manufacturer or inquire on the Internet according to their own PCB parameter requirements to select different models。 | |
| Arlon | The high frequency (HF) material used in the production of high frequency (HF) ceramic plates is mainly made of high frequency (HF) ceramic powder. Arlon can provide different types of boards. If designers choose the materials of this company, they can consult the PCB manufacturer or inquire on the Internet according to their own PCB parameter requirements to select different models. | |
| Tyconic | The low dielectric constant substrate material produced by tyconic company is mainly used for high frequency board (frequency higher than 1GHz), which is a high frequency plate synthesized by polytetrafluoroethylene resin (PTFE). Tyconic can provide different types of boards. If designers choose the materials of this company, they can consult the PCB manufacturer or inquire on the Internet according to their own PCB parameter requirements to select different models. | |
| Nelco | The low dielectric constant substrate material produced by nelco company is mainly used for high frequency board (frequency higher than 1GHz). It is a high frequency plate synthesized by polytetrafluoroethylene resin (PTFE). Nelco can provide different types of boards. If designers choose the materials of this company, they can consult the PCB manufacturer or inquire on the Internet according to their own PCB parameter requirements to select different models. | |
| Notes on surface treatment method: | FR-4 halogen free + high TG | One of the lowest cost PCB surface lead process, it can maintain good solderability. However, for the case of fine pin spacing (< 0.64mm), it may lead to solder bridging and thickness problems. Advantages: good stability, weldability, relatively long-term storage for one year, good compatibility with solder, reliable welding, high production efficiency and low cost. Disadvantages: lead, not in line with environmental requirements, the surface is not smooth, not suitable for density mounting. |
| Lead free tin spray | A lead-free surface treatment process, in line with the "environmental protection" requirements of the product. Advantages: good stability and good weldability. It can be preserved for a relatively long time (half a year). It has good compatibility with solder, reliable welding, high production efficiency and moderate cost. Disadvantages: high temperature of tin spraying and welding, damage to substrate and device. The surface is not smooth, not suitable for high density mounting. | |
| Deposition of tin (chemical deposition) | Compared with spray tin, the surface of chemical deposition process is flat and coplanar. The biggest weakness of tin deposition is short life, especially when stored in high temperature and high humidity environment. Cu / Sn intermetallic compounds will continue to grow until they lose solderability. Advantages: copper layer is directly combined with solder, reliable welding and medium weldability. Smooth surface, suitable for high density mounting. High production efficiency and low cost. Disadvantages: poor heat resistance, poor solderability after many times of welding, short storage time, due to the "tin whisker" phenomenon, may affect the insulation performance. | |
| Precipitation of gold (chemical nickel gold) | Nickel (Ni) / gold (AU) was plated on copper surface by chemical method. This process PCB surface is very flat, coplanar is very good, key, contact surface is nothing else. In addition, this process has excellent solderability, and the gold will melt into the molten solder rapidly, thus exposing the fresh Ni. Due to the good coplanarity of this process, for fine pitch pins (such as BGA with 0.5mm spacing). Advantages: strong oxidation resistance, can be welded for many times, with medium weldability. The surface is smooth and the pad is fully covered, which is suitable for high density mounting. The contact resistance is small, which can be used in the occasion where the button needs to be contacted. Disadvantages: high cost, due to the "black pad" phenomenon, affecting the reliability of the coating stress, not suitable for bonding and flexible occasions. | |
| Gilding (gilding) | Nickel (Ni) / gold (AU) was plated on the surface of copper by electroplating. Advantages: strong oxidation resistance, can be welded for many times, with medium weldability. Smooth surface, suitable for bonding process. The contact resistance is small, which can be used in the occasion where the button needs to be contacted. Disadvantages: the cost is the highest; the convex edge of the line edge is easy to cause short phenomenon, which affects the reliability; it is easy to change the color of gold surface and affect the weldability; the solder joint is brittle. Solder resist ink is easy to fall off on gold surface. | |
| Silver deposition (chemical precipitation) | Electroless silver plating surface technology. In addition, the silver surface is flat and solderable. The disadvantage is high cost. Advantages: good solderability when the coating is fresh. Smooth surface, suitable for high density mounting. High production efficiency and low cost. Disadvantages: poor heat resistance, poor solderability after many times of welding, easy to change color, short storage time, due to "silver migration" phenomenon, may affect the insulation performance. If the silver layer is too thick, the solder joint becomes brittle. | |
| OSP / anti oxidation treatment | Due to the problems such as short weldable period, tackiness and poor resistance to welding, it is suggested that it should not be used. Advantages: copper layer is directly combined with solder, reliable welding and medium weldability. Smooth surface, suitable for high density mounting. High production efficiency, the lowest cost, can be heavy industry. Disadvantages: poor heat resistance, poor weldability after many times of welding, short storage time. |
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