| entry name | Sample capacity (delivery area < 1 ㎡) | Small batch capacity (delivery area ≥ 1 ㎡) | |
| Material type | Common TG FR4: | Shengyi S1141 tu-662 kb-6160 it-158 (medium TG) | Shengyi S1141 tu-662 kb-6160 it-158 (medium TG) |
| Conventional plate | High Tg and halogen-free | Shengyi s1170g kb-6167g | Shengyi s1170g kb-6167g |
| Medium TG halogen-free: | Shengyi s1150g halogen free tg150 kb-6165g | Shengyi s1150g halogen free tg150 kb-6165g | |
| Shengyi s1150g halogen free tg150 kb-6165g | ShengyiS1151G （CTI≥600V） | ShengyiS1151G （CTI≥600V） | |
| High CTI (CTI ≥ 600V) | Shengyi s1600 kb-6160c | ShengyiS1600 KB-6160C | |
| Aerospace, downhole drilling, long-term high and low temperature, aging, chip; packaging substrate； | Shengyi sh260 (TG value 250 ° and dk4.12-4.22) Suzhou Tenghui vt-901 (TG value of 250 ° dk3.9-4.2 halogen-free); packaging substrate material: si10u (s), Mitsubishi Gas BT material (MGC) | Shengyi sh260 (TG value 250 ° and dk4.12-4.22) Suzhou Tenghui vt-901 (TG value of 250 ° dk3.9-4.2 halogen-free); packaging substrate material: si10u (s), Mitsubishi Gas BT material (MGC) | |
| High Tg FR4: | S1000-2M IT180A IT180 TU-768 | S1000-2M IT180A IT180 TU-768 | |
| Ceramic powder filled high frequency board: | Ceramic powder filled high frequency board: | Ro4003, ro4350 and other Rogers 4 series, arlon25n, Shengyi s7136, Shengyi s7135, wl-ct350 | |
| High frequency PTFE materials: | Poly Rogers series, Taconic series, Arlon series, Taizhou Wang | Rogers series, Taconic series, Arlon series, Taizhou Wangling | |
| High frequency sheet PP | RO4450F、RO4450T、RO3010、RO3003、RO3006、Benefit Synamic6、 | RO4450F、RO4450T、Benefit Synamic6、 | |
| High speed series | High speed series (1-5g) | Tu-862、S7038、S1165、Isola-FR408HR、Isola-FR406、your presence-EM370、EM828G IT170GRA NP175FM（South Asia） | Tu-862、S7038、S1165、Isola-FR408HR、Isola-FR406、Taiguang-em370、EM828G IT170GRA NP175FM（South Asia） |
| High speed series（5-10G) | Meg4, tu-872, n4000-13, tu-863 (halogen-free), Shengyi synapc4, em-888, I-speed (Isola) n4800-20si (nelco) it-958g | Meg4, tu-872, n4000-13, tu-863 (halogen-free), Shengyi synapc4, em-888, I-speed (Isola) n4800-20si (nelco) it-958g | |
| High speed series（10-25G) | Meg6, tu-883, benefitsynapmic6, meteorwave1000 / 2000 / 3000 Series (nelco), em-891 (Taiwan light), em-888k, it-968, i-tera mt40 (Isola) | MEG6, tu-883, benefit synapc6, meteorwave1000 / 2000 / 3000 Series (nelco), em-891 (Taiwan light), em-888k, it-968, i-tera mt40 (Isola) | |
| High speed series（＞25G) | MEG7、Tu-933、Meteorwave4000（Nelco)、IT-988、Tachyon 100G(Isola) | MEG7、Tu-933、Meteorwave4000（Nelco)、IT-988、Tachyon 100G(Isola) | |
| Integrated system | product type： | High rise board, back board, HDI, multi-layer buried blind hole mixed pressing, thick copper plate, FR4 reinforcing plate, depth control Gong uncovering cover plate, step board, copper embedded plate, optical module board | High rise board, back board, HDI, multi-layer buried blind hole mixed pressing, thick copper plate, FR4 reinforcing plate, depth control Gong uncovering cover plate, step board, copper embedded plate, optical module board |
| Process capability | Number of layers： | 1-30 floors (more than 30 floors need to be reviewed) | 1-30 floors (more than 30 floors need to be reviewed) |
| High frequency mixed voltage HDI： | Ceramic materials and PTFE materials can only go through mechanical drilling, blind hole burying, depth control drilling, back drilling, etc. (laser drilling is not allowed, and copper foil cannot be directly pressed) | ||
| High speed HDI： | According to the conventional HDI production, 1-4 steps; | Order 1-3 | |
| Laser order | Level 1-5 (≥ 6 need to be reviewed) | Order 1-4 | |
| Plate thickness range： | 0.1-8.0mm(less than 0.2mm, more than 6.5mm need to be reviewed.) | 0.254-6.5mm | |
| Minimum finished product size： | 2.5*2.5mm | 2.5*2.5mm | |
| Maximum finished product size： | 2-20 floors, 21 * 33inch; length: 950mm; | / | |
| Note: the short edge of plate edge exceeding 21inch shall be reviewed. | |||
| Maximum finished copper thickness： | Outer layer 8oz (more than 8oz to be reviewed), inner layer 6oz (more than 6oz to be reviewed) | Outer layer 8oz (more than 8oz to be reviewed), inner layer 6oz (more than 6oz to be reviewed) | |
| Minimum finished copper thickness： | 1/2oz | 1/2oz | |
| Inter layer alignment： | ≤3mil | ≤3mil | |
| Through hole filling range： | Plate thickness ≤ 0.6mm, pore diameter ≤ 0.2mm, hole filling saturation 70%; | Only accept the sample, not batch, batch need to be reviewed | |
| Thickness range of resin plug hole plate： | 254-6.5mm, the resin plug hole of double-sided PTFE plate needs to be reviewed, and PTFE with mixed pressure or pure pressure can be made normally; | 0.254-6.5mm | |
| Plate thickness tolerance： | Plate thickness ≤ 1.0 mm, ± 0.1 mm, double-sided, 4-layer ± 0.05 mm, other tolerances need to be reviewed | Plate thickness ≤ 1.0 mm, ± 0.1 mm, double-sided, 4-layer ± 0.05 mm, other tolerances need to be reviewed | |
| Plate thickness ＞ 1.0mm; ± 10%, other tolerances need to be reviewed | Plate thickness ＞ 1.0mm; ± 10%, other tolerances need to be reviewed | ||
| Special tolerance requirements for plate thickness (no interlayer structure requirement); ± 0.1mm for plates ≤ 2.0mm, ± 0.15mm for 2.1-3.0 plates; (this item needs to be reviewed); ± 0.05mm for double-sided plates ≤ 1.6mm | Special tolerance requirements for plate thickness (no interlayer structure requirement); ± 0.1mm for plates with ≤ 2.0mm and ± 0.15mm for plates of 2.1-3.0; (this item needs to be reviewed and quoted according to IPC class III standard) | ||
| Impedance tolerance： | ±5Ω（＜50Ω），±10%（≥50Ω）；±8%（≥50Ω，To be reviewed) | ±5Ω（＜50Ω），±10%（≥50Ω）；±8%（≥50Ω，To be reviewed) | |
| Warpage: | Normal: 0.75%, limit 0.5% (to be reviewed) maximum 2.0% | 0.75% | |
| Pressing times： | Press the same core plate for no more than 6 times | Press the same core plate for no more than 6 times | |
| Minimum line width / line spacing capability | Inner layer： | 18um（1/2OZ）： 2/2mil（To be reviewed) | 18um（1/2OZ）： 3/3mil |
| 35um（1OZ）： 3/3mil | 35um（1OZ）： 3/3mil | ||
| 70um（2OZ）： 5/5mil或4/5mil | 70um（2OZ）： 5/5mil | ||
| 105um（3OZ）： 6.5/6.5mil | 105um（3OZ）： 6.5/6.5mil | ||
| 140um（4OZ）： 8/8mil | 140um（4OZ）： 8/8mil | ||
| 175um（5OZ）： 10/10mil | 175um（5OZ）： 10/10mil | ||
| 210um（6OZ）： 12/12 mil | 210um（6OZ）： 12/12 mil | ||
| Outer layer： | 12um（1/3OZ）： 2/2mil（To be reviewed) | 12um（1/3OZ）： 2.5/2.5mil | |
| 18um（1/2OZ）： 3/3mil | 18um（1/2OZ）： 3/3mil | ||
| 35um（1OZ）： 5/5mil | 35um（1OZ）： 5/5mil | ||
| 70um（2OZ）： 8/8mil | 70um（2OZ）： 9/9mil | ||
| 105um（3OZ）： 10/10mil | 105um（3OZ）： 10/10mil | ||
| 140um（4OZ）： 10/13mil | 140um（4OZ）： 13/13mil | ||
| 175um（5OZ）： 12/15mil | 175um（5OZ）： 14/14mil | ||
| Note: 1.5oz, 2.5oz, 3.5oz base copper shall not be used for plate with copper thickness of more than 70UM and plate with ultimate compensation capacity; | / | ||
| Minimum line width / line spacing capability | Line width tolerance： | ≤10mil;±1.0mil; ＞10mil;±1.2mil | ±20% |
| The size of inner and outer pads of laser hole is the smallest： | 5MIL (pore diameter 3mil), 6mil (pore diameter 4mil), 8mil (pore diameter 6mil) | 5MIL (pore diameter 3mil), 6mil (pore diameter 4mil), 8mil (pore diameter 6mil) | |
| The size of inner and outer pads of mechanical through hole is the smallest | One side of the welding ring is 3ml larger than the hole (allowable thickness of finished copper is 1oz, the limit of one side of plate is 1.mil) | One side of the welding ring is 4mil larger than the hole | |
| BGA pad diameter minimum: | 4mil (limited to OSP, electroplating process), to be reviewed | 8mil | |
| BGA clamp line width: | 2.4mil, less than 2.4mil needs to be reviewed | 3mil | |
| BGA clamping distance: | The distance between BGA and clamp is 2.2mil | 3mil | |
| Binding IC | For 2.4/2.4mil-3/3mil gold process, nickel palladium can be recommended if it is more than 3 / 3MI | 2.4/2.4mil | |
| The minimum diameter of lead sprayed tin BGA is as follows | 8mil | 12mil | |
| Minimum diameter of lead-free tin spraying BGA: 1 | 8mil | 12mil | |
| The minimum diameter of BGA on lead-free tin coated copper is as follows | 10mil | 12mil | |
| Pad tolerance: | ± 1mil (BGA diameter less than 10mil); ± 10% (BGA diameter greater than 10mil) | ±1.5mil（BGA diameter less than 10mil); ± 15% (BGA diameter greater than 10mil) | |
| Minimum width of inner isolation belt: | 5mil | 8mil | |
| Minimum number and width of inner channel: | 1oz base copper, 5MIL ≥ 2 strips | 1oz base copper, 5MIL ≥ 2 strips | |
| The thickness of inner layer copper and cathode is as follows: | 18/35um、35/70um、70/105um、35um/105um、 | 18/35um、35/70um、70/105um、35um/105um、 | |
| Hole to conductor | Minimum distance between drilling hole and conductor | 4 layers: 3mil; 6-8 layers: 4mil; 10-16 layers: 4mil; 18-22 layers: 6mil; 24-28 layers: 8mil; ≥ 30 layers: 12mil | Four layers: 4mil; 6-8 layers: 4mil; 10-12 layers: 4mil; 12-16 layers: 6mil; 18-22 layers: 8mil; more than 24 layers of batch review; |
| Minimum distance between drill hole and conductor (blind hole) | Three times of pressing: 4mil; three times of pressing: 4mil; t | hree times of pressing: 4mil; three times of pressing: 4mil | |
| Minimum distance between laser drilling and conductor | 3mil | 5mil | |
| hole | Minimum tool diameter of mechanical hole: | 0.1-6.3mm and 0.1mm boreholes need to be reviewed | 0.1-6.3mm，0.1mm boreholes need to be reviewed |
| Minimum tool diameter of PTFE material and mixed pressure drill tool: | 0.15mm | 0.15mm | |
| Minimum drill tool diameter for half hole: | 0.3mm | 0.3mm | |
| Minimum diameter of drilling tool for connecting hole: | 0.5mm | 0.5mm | |
| The relationship between the hole diameter of mechanical drilling and the thickness of plate is as follows | 0.15mm（Plate thickness≤1.6mm） 0.1mm（Plate thickness≤1.0mm） | 0.15mm（Plate thickness≤1.6mm） 0.1mm（Plate thickness≤1.0mm） | |
| 0.2mm(Plate thickness ≤ 2.4mm) | 0.2mm(Plate thickness≤2.0mm) | ||
| Thickness ratio of aperture plate: | The maximum plate thickness to aperture ratio is 20:1 (process review is required if it is greater than 14:1), | 12:1（(process review is required if it is greater than 14:1), | |
| Tolerance of hole position accuracy (compared with CAD data) | ±3mil | ±3mil | |
| PTH aperture tolerance: | ±2mil | ±3mil | |
| hole | Working error of aperture of solderless device (crimp hole) | ±2mil | ±2mil |
| Npth aperture tolerance: | ±2mil，﹢2/-0，﹢0/-2 | ±2mi | |
| Pore size range of resin plug hole: | 0.254-6.5mm(> 0.7mm hole is allowed to sag) | 0.254-6.5mm(> 0.7mm hole is allowed to sag) | |
| The maximum diameter of laser drilling is: 1 | 8mil (corresponding dielectric thickness should not exceed 0.15mm) | 8mil（The corresponding dielectric thickness shall not exceed 0.15mm) | |
| The laser drilling hole diameter is the smallest | Routine 4mil, 3mil (corresponding to 106pp) needs to be reviewed | 4mil | |
| Minimum diameter of back hole: | With copper hole 0.15mm, without copper hole 0.25mm | With copper hole 0.15mm, without copper hole 0.25mm | |
| Thickness of insulating layer between back drilling layers (target layer and next layer, suitable for high frequency mixed voltage HDI production) | ≥0.10mm | ≥0.10mm | |
| Back drilling depth accuracy tolerance: | ±0.02mm | ±0.03mm | |
| Angle and diameter of tapered hole and stepped hole: | Special tool: 82 °, 90 °, 100 ° and 135 ° (diameter range of conical hole drill is 0.3-10 mm) | Special tool: 82 °, 90 °, 100 ° and 135 ° (diameter range of conical hole drill is 0.3-10 mm) | |
| Common cutter: angle 130 ° (drill tool diameter ≤ 3.175mm), 165 ° (drill tool diameter 3.175-6.3mm) | Common cutter: angle 130 ° (drill tool diameter ≤ 3.175mm), 165 ° (drill tool diameter 3.175-6.3mm) | ||
| Angle tolerance of stepped and tapered holes: | ±10° | ±10° | |
| hole | Diameter tolerance of stepped and tapered holes: | ±0.20mm | ±0.20mm |
| Depth tolerance of stepped and tapered holes: | ±0.15mm | ±0.15mm | |
| Minimum distance between hole walls of the same network (after compensation) | 6mil | 8mil | |
| The minimum distance between the hole walls of different networks (after compensation) | 8mil | 10mil(no matter the sample and batch size of military products, 16 mil should be guaranteed) | |
| Minimum distance between through hole and blind hole wall (after compensation): 1 | 6mil | 8mil | |
| Depth tolerance of npth groove / edge in depth controlled milling: | ±0.1mm | ±0.15mm | |
| Minimum tolerance for slot drilling: | Npth is ± 0.05mm in width and ± 0.075mm in length; PTH is ± 0.10mm in width and ± 0.13MM in length | Npth is ± 0.075mm in width and ± 0.075mm in length; PTH is ± 0.10mm in width and ± 0.13MM in length | |
| Minimum tolerance of milling slot hole: | Npth: groove width and groove length direction are ± 0.10mm (complex inner groove and ultra short groove requirements need to be reviewed); PTH: groove width and groove length direction are ± 0.13MM | Npth: groove width and groove length direction are ± 0.10mm (complex inner groove and ultra short groove requirements need to be reviewed); PTH: groove width and groove length direction are ± 0.13MM | |
| Type of surface treatment | unleaded: | Lead free tin spraying, electroplating hard gold, sinking gold, sinking tin, sinking silver, OSP, sinking gold + OSP, spraying Tin + gold finger, sinking gold + gold finger, water gold + selective hard gold, nickel palladium, OSP + gold finger | Lead free tin spraying, electroplating hard gold, sinking gold, sinking tin, sinking silver, OSP, sinking gold + OSP, spraying Tin + gold finger, sinking gold + gold finger, nickel palladium, OSP + gold finger |
| Lead: | Tin spray with lead | Tin spray with lead | |
| Maximum machining size: | Gold deposition: 520 * 800mm, vertical tin deposition: 500 * 600mm, horizontal tin deposition: single side less than 500mm; horizontal silver deposition: single side less than 500mm; lead / lead-free spray tin: 520 * 650mm; OSP: single side less than 500mm; electroplating hard gold: 450 * 500mm; single side is not allowed to exceed 520mm | / | |
| Minimum machining size: | Tin deposition: 60 * 80mm; silver deposition: 60 * 80mm; lead / lead-free spray tin: 150 * 230mm; OSP: 60 * 80mm; run large plate surface for the size smaller than above | 沉锡：80*80mm；沉银：80*80mm；有铅/无铅喷锡：150*230mm；OSP：80*80mm；电镀硬金：150*230mm | |
| Processing plate thickness: | Gold deposition: 0.2-7.0 mm, tin deposition: 0.3-7.0 mm (vertical tin line), 0.3-3.0 mm (horizontal) | Gold deposition: 0.4-6.5mm, tin deposition: 0.3-4.5mm (vertical tin line), 0.3-3.0mm (horizontal) | |
| The results show that: 1) silver deposition: 0.3-3.0mm; lead / lead-free tin spraying: 0.6-3.5mm; tin spraying plate below 0.4mm needs to be reviewed and manufactured; OSP: 0.3-3.0mm; electroplating hard gold: 0.3-5.0mm (plate thickness ratio 10:1) | The results showed that: silver deposition: 0.3-3.0mm; lead / lead-free tin spraying: 0.6-3.5mm; OSP: 0.3-3.0mm; electroplating hard gold: 0.3-5.0mm; silver deposition: 0.3-3.0mm; lead / lead-free tin spraying: 0.6-3.5mm; OSP: 0.3-3.0mm; electroplating hard gold: 0.3-5.0mm; | ||
| The minimum spacing between IC and pad or between pad and line is as follows: | 3mil | 4mil | |
| Minimum distance between golden fingers: | 5mil | 6mil | |
| Surface coating thickness | Tin spray: | 6-40um | 6-40um |
| Sinking Gold: | Nickel thickness: 3-5um; gold thickness: 1-4uinch, ≥ 4uinch, to be reviewed | Nickel thickness: 3-5um; gold thickness: 1-4uinch | |
| Tin deposition: | ≥1um | ≥1um | |
| Sinking silver: | 6-12uinch | 6-12uinch | |
| OSP: | 0.2-0.4um | 0.2-0.4um | |
| Nickel palladium: | Nickel thickness: 3-5um, palladium thickness: 1-6uinch, gold thickness: 1-4uinch | NI:3-5um，Pd：1-6uinch，Au：1-4uinch | |
| Hard gold plating: | 2-50u (> 50U to be reviewed) | 2-50u（>50u shall be reviewed) | |
| Select gold plating (partial gold plating + whole plate electroplating gold plating) | 2-50u（>More than 50U shall be reviewed), and the local electrogold with line width less than 0.10mm and above 30U shall be reviewed | ||
| Electroplated gold finger: | 2-50u（>More than 50U shall be reviewed) | 2-50u（>50u shall be reviewed) | |
| appearance | Shape delivery method: | Veneer: V-CUT; bridging; bridging + stamp hole; bridging + V-CUT; bridging + V-CUT + stamp hole | Veneer: V-CUT; bridging; bridging + stamp hole; bridging + V-CUT; bridging + V-CUT + stamp hole |
| Dimension tolerance: | ±0.1mm；limit±0.05mm | ±0.1mm；limit±0.05mm | |
| Shape and position tolerance: | ±0.1mm | ±0.1mm | |
| Distance between V-CUT center line and inner line pattern (H refers to plate thickness) | H≤1.0mm；0.3mm（angle20°），0.33mm（angle30°），0.37mm（angle45°） | H≤1.0mm；0.3mm（angle 20°），0.33mm（angle 30°），0.37mm（angle 5°） | |
| 0 ＜ h ≤ 1.6mm; 0.36mm (angle 20 °), 0.4mm (angle 30 °), 0.5mm (angle 45 °) | 1.0＜H≤1.6mm；0.36mm（angle 20°），0.4mm（angle 30°），0.5mm（angle 45°） | ||
| 1.6 ＜ h ≤ 2.4mm; 0.42mm (angle 20 °), 0.51mm (angle 30 °), 0.64mm (angle 45 °) | 1.6＜H≤2.4mm；0.42mm（angle 20°），0.51mm（angle 30°），0.64mm（angle 45°） | ||
| 2.5 ≤ h ≤ 3.0mm; 0.47mm (angle 20 °), 0.59mm (angle 30 °), 0.77mm (angle 45 °) | 2.5 ≤ h ≤ 3.0mm; 0.47mm (angle 20 °), 0.59mm (angle 30 °), 0.77mm (angle 45 °) | ||
| Minimum distance of outer circuit without copper exposed in milling profile: | 8mil | 8mil | |
| appearance | Minimum distance of inner layer line without copper exposed in milling profile: | 10mil | 10mil |
| The minimum distance between the golden finger chamfering and tab is as follows: | 6mm | 8mm | |
| Tolerance of fillet thickness of gold finger: | ±5mil | ±5mil | |
| Minimum radius of internal angle: | 0.3mm | 0.4mm | |
| V-CUT angle tolerance: | ±5° | ±5° | |
| V-CUT angle specification: | 20°、30°、45° | 20°、30°、45° | |
| V-CUT symmetry tolerance: | ±4mil | ±4mil | |
| Thickness range of V-CUT plate: | 0.4-3.2mm | 0.4-3.2mm | |
| Safety distance of cutter tripping V-CUT: | 12mm（Plate thickness≤1.6mm） | 15mm(plate thickness ≤ 1.6mm) | |
| Golden finger angle specification: | 20°、30°、45°、60° | 20°、30°、45°、60° | |
| Minimum distance between gold finger side edge and contour edge line: angle tolerance of golden finger chamfering angle: | ±5° | ±5° | |
| The minimum distance between the side of golden finger and the contour edge line: | 8mil | 8mil | |
| Solder mask character | Solder mask ink color: | Green, yellow, black, blue, red, white, green matte, black matte, orange and other colors | Green, yellow, black, blue, red, white, green matte, black matte, orange and other colors |
| Character ink color: | White, yellow, black, orange and other colors | White, yellow, black, orange and other colors | |
| Minimum width of solder bridge: | 4mil (green), 5MIL (other colors) (bottom copper ≤ 1oz) less than 4mil shall be reviewed | 4mil (green), 5MIL (other colors) (bottom copper ≤ 1oz) | |
| The width of green oil cover line is the smallest on one side | 2mil (local 1.5mil allowed) | 2mil | |
| Minimum width and height of characters: | Line width 4.5mil, height 23mil (12um, 18um base copper); line width 5MIL, height 30mil (35um base copper: line width 6mil, height 45mil (70UM base copper) | Line width 4.5mil, height 23mil (12um, 18um base copper); line width 5MIL, height 30mil (35um base copper: line width 6mil, height 45mil (70UM base copper) | |
| Carbon oil: | 10-50um | 10-30um | |
| Blue glue: Solder Mask Ink: | Copper cover oil: 10-18um; through hole cover oil: ≥ 5um; circuit corner: ≥ 5um (primary printing) | Copper cover oil: 10-18um; through hole cover oil: ≥ 5um; circuit corner: ≥ 5um (primary printing) | |
| Blue glue: | 0.20-0.60mm | 0.20-0.60mm | |
| Solder mask character | Maximum diameter of blue glue plug hole: | 6.5mm | 5mm |
| Maximum diameter of Solder plug hole: | 0.55mm | 0.45mm | |
| Resin plug hole line width / line distance minimum: | 2.5/2.5mil、 | 3/3mil | |
| Type of character print mark (white characters only) | Serial number, barcode, QR code | Serial number, barcode, QR code | |
| Minimum distance between blue glue and pad: | 14mil | 14mil | |
| Minimum distance between character and pad: | 4mil | 4mil | |
| Minimum distance between carbon oil and carbon oil: | 12mil | 14mil | |
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